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Robert J. Tesch is Vice President of Engineering at CMC Interconnect Technologies. CMC is a "technology solutions" company that provides "root cause" identification and resolution, analytical services, program management, and marketing research for clients focusing on advanced materials and all levels of electronic interconnection. Robert (Bob) Tesch has over twenty years of experience in the electronic packaging manufacturing business. He has worked with both Alumina and Aluminum Nitride materials through all phases of processing from product design, process development, tape casting/ink formulations, greensheet processing, plating, reliability/quality and critical path resolution. Bob's professional record includes solid technical and scientific experience with CMC Wireless Components, Carborundum Microelectronics and the Unisys Corporation. Bob has directed engineering teams in the successful development and qualification of many product lines and technology transfer to a manufacturing site in S.E. Asia. Bob has a strong understanding of project and program management and the critical aspects of materials design, characterization, and documentation. Bob received his MS in Ceramic Engineering from Iowa State University in Ames, Iowa with a BS background in Physics and Mathematics. He belongs to the American Ceramic Society. | 