Mostafa Aghazadeh is vice president, Technology and Manufacturing Group, and director of Chandler Assembly Technology Development. He is responsible for development and deployment of the CPU packaging and assembly technologies and development of packaging materials suppliers.
He has held a variety of technical and management positions at Intel, including, most recently, director of the Platform, Materials and Enabling group where he was responsible for packaging technology and enabling collateral development and transfer to high-volume manufacturing for IA products. Previously, Aghazadeh was responsible for packaging materials technology development and suppliers ramp.
Aghazadeh joined Intel in 1984. From then until 1992 he served as a thermal engineer responsible for thermal design, modeling and characterization of all Intel packages, including the 286, 386, 486 and Pentium Processors.
He holds six U.S. patents in electronic packaging.
Aghazadeh received his bachelor's degree in mechanical engineering from the University of Tennessee in 1980 and a master's degree in mechanical engineering from the Georgia Institute of Technology in 1982.