|
Leo M. Higgins III, Ph. D. has 27 years of experience in the semiconductor packaging industry, and has been with ASAT, Inc. for 3 years, earlier as the Director of Applications Engineering, and now as the Vice President of Engineering and Technology. Previously Dr. Higgins was with Siemens for 5 years directing new IC Packaging Technology, die bonder development, and laser via drilling business development. Before this he directed leading edge IC packaging development at Motorola Semiconductor for 10 years. Earlier Dr. Higgins lead computer CPU system packaging development at Prime Computer, and multilayer ceramic packaging at Cabot/Augat Ceramics, and Kyocera. He holds 27 issued USA patents and has published over 70 papers, and two book chapters. Dr. Higgins holds a Ph.D. in Ceramic Engineering from Rutgers University. | 