The group’s principle activities include developing automated electroplating tools for the semiconductor assembly industry. The group’s tools are designed to deposit conductive metals on wafers through a proprietary electroplating process. The group operates through four segments namely flip chip wafer bumping, wafer scale csp packaging, high density laminate flip chip substrates andsolar cell plating and thru-wafer via interconnections. for Sep 2006, the group merged with wholly owned subsidiary Surfect Technologies. The group operates from the United States.
