The group's principal activities are to design, develop, manufacture and service wet chemical processing equipment for use in the fabrication of semiconductor devices. The primary suites of tools of the group include electrochemical deposition systems for electroplating copper, gold, solder and other metals; cleaning, stripping and etching systems; and wafer container cleaning tools. The equipment is utilized in semiconductor fabrication front-end and back-end processes, including wafer level packaging. The customers of the group include major semiconductor device and wafer level packaging manufacturers worldwide. International sales are carried on in Europe, Japan, Asia and other countries.
