The group’s principal activity is to supply electronic interconnect solutions and electro mechanical equipment. The group’s services include design and layout, electrical and mechanical modelling, enviornmental testing, prototype, research and development.. The products of the group include wire bond, flip chip, printed circuit board fabrication, assembly solution and customer process equipment. Specific customers of the group include IBM, Sun, Hutchinson, Cadence, Juniper, Cisco, Agilent and Boeing. The group operates from New York.
