The group's principal activity is manufacturing semiconductor packaging, plating, die attach and die sort equipment for the semiconductor industry. These equipment are used to produce semiconductor packages, which provide the electronic interface and physical connection between the chip and other electronic components. These equipment also protect the chip from the external environment. The packaging equipment consists of automated molding systems that encapsulate semiconductor devices in epoxy resin. The plant and singulation equipment consists of fully automated tin-lead planting systems. The die attach equipment consists of manual and automated high precision systems which place the contact points of the chip in direct contact with the packaged substrate. The group's customers include Amkor, Lucent Technologies, Motorola and Philips.
